Design of Experiments (DoE) Workflow with Focus on Wafer Uniformity in Semiconductor Industries
Learn how to apply Design of Experiments to improve wafer uniformity and process understanding in semiconductor manufacturing.
This whitepaper outlines a practical DoE workflow in Cornerstone software using a semiconductor contact hole etching example. It shows how to move from problem definition and factor-response setup to experiment design, data analysis, and optimization in a more structured way than trial-and-error approaches.
What you will learn:
- How to define factors, responses, and constraints for a semiconductor DoE study
- How to choose model and design types based on process needs and run limitations
- How to use regression analysis to assess model fit, residuals, and significant effects
- How to evaluate wafer uniformity using wafer map data and positional analysis in Cornerstone
Download the whitepaper to see how Cornerstone software supports a more systematic approach to semiconductor process optimization and wafer uniformity analysis.