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BGATECHNOLOGY
Visit Supplier WebsiteBGA is a technology leader in tin whisker mitigation processes for high reliability applications including Aerospace, Defense and Industrial Devices. Our state of the art facility uses 6-axis robotic cells, which have had process approvals by major defense primes.
Providing RHSD and Reballing service since 2010. Member of PERM / IPC, striving to develop industry standards. Providing quotes within 24 hours.
- RHSD capacity in excess of 40k units/day.
- 3-4 week lead time / 7-10 days for smaller quantities.
- Inventory management capability reducing additional touch cost for OEM & CM's.
Services Include:
- Re-Balling
- Robotic Hot Solder Dip (RHSD)
- Robotic Gold Embrittlement Mitigation
- Bonded Warehouse and Kitting Services
Certifications include:
- AS9100D & ISO9001:2015 Certified
- ESD Certified Production Floor
- ITAR Registered Cage Code 6EMC9
- ANSI/ESD-S20.20-2014 Certified
Manufacturing process meets both:
- Military/Aerospace RHSD standard (GEIA-STD-0006)
- Military Standard for Re-Balling (IEC/TS 62647-4)
Company Headquarters Location
Company Type
Original Component Manufacturer
Geography Served
Annual Revenue ($)
Number of Employees
51 – 200 employees
Key Component Category
PCBs & Other Circuit Carriers
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